Nitrogen dioxide, carbon dioxide and sulphur dioxide are acidic gas and they produce corrosive medium for copper sculptures. These gases absorb moisture to form nitric acid, carbonic and sulphuric acid. It forms corrosion cell on the surface of copper and accelerate corrosion reactions. The corrosion cell formation is written as: Cu|Cu2+||H+|H2 thus corrosion reactions start and copper is oxidized into Cu2+surface and it is oxidized into Cu2+ whereas H+ ion is reduced into H2. Nitric acid environment copper exhibits galvanic, pitting, stress, crevice, blistering, embrittlement and intergranular corrosion. The corrosion reactions change physical, chemical and mechanical properties of corroded materials. Nanocoating compound tetrahydro-dibenzo[a,d][7]annulene-5,11-disemicarbazoneand SiC electrospray compounds used to control the corrosion of copperin nitrogen dioxide medium. For corrosion mitigation of copper metal interface was coated with tetrahydro-dibenzo[a,d][7]annulene-5,11-disemicarbazone and SiC. The coating compound tetrahydro-dibenzo[a,d][7]annulene-5,11-disemicarbazone was synthesized in laboratory. Nozzle sprays techniques used for nanocoating and electrospraying. The corrosion rate of copper was determined by gravimetric loss method at different temperatures, concentrations and days in nitrogen dioxide medium. Potentiostatic polarization technique used for the determination of electrode potential, corrosion current and current density. Nanocoating and electrospraying compounds formed a composite barrier on the surface of base metal by chemical bonding. The nanocoating and electrospray compounds adhered on base metal by chemisorptions to confirm byactivation energy, heat of adsorption, free energy, enthalpy and entropy. The nanocoating and electrospray deposited on copper confirmed by Langmuir, Frundlich and Temkin isotherm. Copperformed a complex compound to interact with tetrahydro-dibenzo[a,d][7]annulene-5,11-disemicarbazone and SiC. Electrospraying SiC blocked porosities of nanocoating compound and checked osmosis process of nitrogen dioxide. The nanocoating and electrospray compounds decreased corrosion rate and increased surface coverage areas and percentage coating efficiencies.
| Published in | International Journal of Materials Science and Applications (Volume 11, Issue 4) |
| DOI | 10.11648/j.ijmsa.20221104.12 |
| Page(s) | 95-101 |
| Creative Commons |
This is an Open Access article, distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution and reproduction in any medium or format, provided the original work is properly cited. |
| Copyright |
Copyright © The Author(s), 2024. Published by Science Publishing Group |
Copper, Composite Barrier, Nanocoating, Electrospraying, Nozzle Spray, Thermal Parameters, SiC
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APA Style
Rajesh Kumar Singh, Hema Kesavan, Jay Prakash Singh. (2022). Corrosion Protection of Copper Sculptures by Corrosive Pollutants. International Journal of Materials Science and Applications, 11(4), 95-101. https://doi.org/10.11648/j.ijmsa.20221104.12
ACS Style
Rajesh Kumar Singh; Hema Kesavan; Jay Prakash Singh. Corrosion Protection of Copper Sculptures by Corrosive Pollutants. Int. J. Mater. Sci. Appl. 2022, 11(4), 95-101. doi: 10.11648/j.ijmsa.20221104.12
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Download@article{10.11648/j.ijmsa.20221104.12,
author = {Rajesh Kumar Singh and Hema Kesavan and Jay Prakash Singh},
title = {Corrosion Protection of Copper Sculptures by Corrosive Pollutants},
journal = {International Journal of Materials Science and Applications},
volume = {11},
number = {4},
pages = {95-101},
doi = {10.11648/j.ijmsa.20221104.12},
url = {https://doi.org/10.11648/j.ijmsa.20221104.12},
eprint = {https://article.sciencepublishinggroup.com/pdf/10.11648.j.ijmsa.20221104.12},
abstract = {Nitrogen dioxide, carbon dioxide and sulphur dioxide are acidic gas and they produce corrosive medium for copper sculptures. These gases absorb moisture to form nitric acid, carbonic and sulphuric acid. It forms corrosion cell on the surface of copper and accelerate corrosion reactions. The corrosion cell formation is written as: Cu|Cu2+||H+|H2 thus corrosion reactions start and copper is oxidized into Cu2+surface and it is oxidized into Cu2+ whereas H+ ion is reduced into H2. Nitric acid environment copper exhibits galvanic, pitting, stress, crevice, blistering, embrittlement and intergranular corrosion. The corrosion reactions change physical, chemical and mechanical properties of corroded materials. Nanocoating compound tetrahydro-dibenzo[a,d][7]annulene-5,11-disemicarbazoneand SiC electrospray compounds used to control the corrosion of copperin nitrogen dioxide medium. For corrosion mitigation of copper metal interface was coated with tetrahydro-dibenzo[a,d][7]annulene-5,11-disemicarbazone and SiC. The coating compound tetrahydro-dibenzo[a,d][7]annulene-5,11-disemicarbazone was synthesized in laboratory. Nozzle sprays techniques used for nanocoating and electrospraying. The corrosion rate of copper was determined by gravimetric loss method at different temperatures, concentrations and days in nitrogen dioxide medium. Potentiostatic polarization technique used for the determination of electrode potential, corrosion current and current density. Nanocoating and electrospraying compounds formed a composite barrier on the surface of base metal by chemical bonding. The nanocoating and electrospray compounds adhered on base metal by chemisorptions to confirm byactivation energy, heat of adsorption, free energy, enthalpy and entropy. The nanocoating and electrospray deposited on copper confirmed by Langmuir, Frundlich and Temkin isotherm. Copperformed a complex compound to interact with tetrahydro-dibenzo[a,d][7]annulene-5,11-disemicarbazone and SiC. Electrospraying SiC blocked porosities of nanocoating compound and checked osmosis process of nitrogen dioxide. The nanocoating and electrospray compounds decreased corrosion rate and increased surface coverage areas and percentage coating efficiencies.},
year = {2022}
}
TY - JOUR T1 - Corrosion Protection of Copper Sculptures by Corrosive Pollutants AU - Rajesh Kumar Singh AU - Hema Kesavan AU - Jay Prakash Singh Y1 - 2022/10/31 PY - 2022 N1 - https://doi.org/10.11648/j.ijmsa.20221104.12 DO - 10.11648/j.ijmsa.20221104.12 T2 - International Journal of Materials Science and Applications JF - International Journal of Materials Science and Applications JO - International Journal of Materials Science and Applications SP - 95 EP - 101 PB - Science Publishing Group SN - 2327-2643 UR - https://doi.org/10.11648/j.ijmsa.20221104.12 AB - Nitrogen dioxide, carbon dioxide and sulphur dioxide are acidic gas and they produce corrosive medium for copper sculptures. These gases absorb moisture to form nitric acid, carbonic and sulphuric acid. It forms corrosion cell on the surface of copper and accelerate corrosion reactions. The corrosion cell formation is written as: Cu|Cu2+||H+|H2 thus corrosion reactions start and copper is oxidized into Cu2+surface and it is oxidized into Cu2+ whereas H+ ion is reduced into H2. Nitric acid environment copper exhibits galvanic, pitting, stress, crevice, blistering, embrittlement and intergranular corrosion. The corrosion reactions change physical, chemical and mechanical properties of corroded materials. Nanocoating compound tetrahydro-dibenzo[a,d][7]annulene-5,11-disemicarbazoneand SiC electrospray compounds used to control the corrosion of copperin nitrogen dioxide medium. For corrosion mitigation of copper metal interface was coated with tetrahydro-dibenzo[a,d][7]annulene-5,11-disemicarbazone and SiC. The coating compound tetrahydro-dibenzo[a,d][7]annulene-5,11-disemicarbazone was synthesized in laboratory. Nozzle sprays techniques used for nanocoating and electrospraying. The corrosion rate of copper was determined by gravimetric loss method at different temperatures, concentrations and days in nitrogen dioxide medium. Potentiostatic polarization technique used for the determination of electrode potential, corrosion current and current density. Nanocoating and electrospraying compounds formed a composite barrier on the surface of base metal by chemical bonding. The nanocoating and electrospray compounds adhered on base metal by chemisorptions to confirm byactivation energy, heat of adsorption, free energy, enthalpy and entropy. The nanocoating and electrospray deposited on copper confirmed by Langmuir, Frundlich and Temkin isotherm. Copperformed a complex compound to interact with tetrahydro-dibenzo[a,d][7]annulene-5,11-disemicarbazone and SiC. Electrospraying SiC blocked porosities of nanocoating compound and checked osmosis process of nitrogen dioxide. The nanocoating and electrospray compounds decreased corrosion rate and increased surface coverage areas and percentage coating efficiencies. VL - 11 IS - 4 ER -
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