Effect of Reflow Profile Parameters on Surface Mount Chip Resistor Solder Joint Shear Strength
International Journal of Materials Science and Applications
Volume 3, Issue 5, September 2014, Pages: 254-259
Received: Aug. 10, 2014;
Accepted: Aug. 30, 2014;
Published: Sep. 30, 2014
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Peter K. Bernasko, Electronics Manufacturing Engineering Research Group, School of Engineering at Medway, University of Greenwich, Chatham Maritime, Kent, ME4 4TB, UK
Sabuj Mallik, Electronics Manufacturing Engineering Research Group, School of Engineering at Medway, University of Greenwich, Chatham Maritime, Kent, ME4 4TB, UK
G. Takyi, Department of Mechanical Engineering, Kwame Nkrumah University of Science and Technology, Kumasi, Ghana
The focus of this study is on the effect of reflow parameters on the joint shear strength. Eight reflow profiles were developed using four factors at two levels of Taguchi design of experiment for 1206, 0805 and 0603 chip resistors. Normal probability and main effect plots were used to provide a complete profile of the effect of reflow parameters on the chip resistor solder joint shear strength. The Normal Probability plots show effect of some reflow parameters on shear strength. Some data points did not fall on the best fit line.These outliers indicate parameter effects. The 1206 chip resistor shear strength value of 74.85N lies outside the best fit line indicating that some of the parameters are critical and significantly affect the response value. The results of the Main Effect plots help identify the unknown critical parameters in the probability plots. It indicates that the shear strength of 1206 chip resistor depends on the peak temperature, time above liquidus and preheat slope but not on cooling rate. In the case of the 0805 chip resistor, there were no exceptional departures from the line fitted to the data. It can be assumed that the factors and the levels considered here have no significant effect on the response. The normal probability plot of the 0603 chip resistor shows that the 46.68N shear strength lies outside the fitted line. This means that the factors and settings (run 3) can be further modified to improve the response. The factors which affected the 0603 resistor from the main effect plot are preheat slop and cooling rate.The results of the 1206 chip resistor show the highest shear force of 74.8 N using a peak temperature setting of 230°C (low level). The 0805 and 0603 chip resistors recorded the highest shear forces of 68.32N and 46.48 respectively using a temperature of 245°C (high level). The higher temperature may have contributed to the lower shear force due to the growth of brittle intermetallic compound in the case of the 0805 and 0603 chip resistors.
Peter K. Bernasko,
Effect of Reflow Profile Parameters on Surface Mount Chip Resistor Solder Joint Shear Strength, International Journal of Materials Science and Applications.
Vol. 3, No. 5,
2014, pp. 254-259.
N.-C. Lee (1999), "Optimizing the reflow profile via defectmechanism Analysis," Soldering & Surface MountTechnology, pp. 13-20.
Ning-Cheng Lee (1997), “Reflow Soldering: Meeting the SMT Challenge”, in Proc. of Nepcon West, Anaheim, CA, Feb. 1997.
M. R. Harrison (2001), "Lead-free reflow soldering forelectronics assembly," Soldering & Surface MountTechnology, vol. 13/3, pp. 21-38.
Beddingfield, C., Higgins, L., (1996), “Moisture Sensitivity and Component Reliability of Flip Chip PBGA Assemblies,” EPS proceedings of technical conference, pp. 26-26.
Munamarty, R., McCluskey, P., (1996), “Popcorning in Fully Populated and Perimeter PlasticBall Grid Array Packages,” Solder &Surface Mount Technology, Iss: 22, pp.46-50.
RanjitPandher, NavendraJodhan, Rahul Raut, and Michael Liberatore Cookson (2010) Electronics Head-in-Pillow Defect– Role of the Solder Ball Alloy, 12th Electronics Packaging Technology Conference
B. Salam, C. Virsead, H. Da, N. N. Ekere, and R.Durairaj (2004), "Reflow profile study of the Sn-Ag-Cu solder "Soldering & Surface Mount Technology, vol. 16/1, pp. 27-34.
H. D. Blair, T.-Y. Pan and J. M. Nicholson (1998): 48th Electronic Components and Technology Conference, pp. 259–267.
H. M. Lee, S. W. Yoon and B.-J. Lee: J. Electron. Mater.27 (1998) pp.1161–1166.
D. R. Frear, W. B. Jones and K. R. Kinsman: Solder Mechanics, (TMS, Warrendale, 1991) pp. 29–104.
J. Pan (2006), "The effect of reflow profile on SnPb and SACsolder joint shear strength," Soldering & Surface MountTechnology,vol. 18/4, pp. 48-56.
Arra, M.; Shangguan, D.; Ristolainen, E.; and Lepisto, T (2002)., “Effect of Reflow Profile on Wetting and Intermetallic Formation Between Sn/Ag/Cu Solder Components and Printed Circuit Boards,” Soldering and Surface Mount Technology, Vol. 14 No. 2, pp.18-25.
P. Borgesen, T. Bieler, L. P. Lehman, and E. J. Cotts (2007), “Pb-free solder: New materials considerations for microelectronics processsing,” MRSBull., vol. 32, no. 4, pp. 360–365.
Santos, D., S. Saiyed and F. Andros,( 2002). Effect of reflow profile on shear strength of Sn/4.0Ag/0.5Cu solders spheres for ball grid array applications. J. Surface Mount Technol. Assoc., 15: 25-31.
Pan, J., Toleno, B.J., Chou, T. and Dee, W.J. (2006), “The effect of reflow profile on SnPb and SnAgCu solder joint shear strength”, Soldering & Surface Mount Technology, Vol. 18 No. 4, pp. 48-56.
Webster, J., Pan, J. and Toleno, B.J. (2007), “Investigation of the lead-free solder joint shear performance”, Journal of Microelectronic and Electronics Packaging, Vol. 4 No. 2, pp. 72-7
Milos Dusek, Martin Wickham, Christopher Hunt, (2005), The impact of thermal cycling regime on the shear strength of lead-free solder joints, Soldering & Surface Mount Technology, Vol. 17, Issue 2, pp. 22–31
Robert H. Lockner and Joseph E. Matar (1990), Designing for Quality: An Introduction to the Best of Taguchi and Western Methods of Statistical Experimental Design, Chapman and Hall, London, ISBN 0-412-40020-0