Residual Stresses in Transparent Glassceramics and Their Evolution During Step-by-Step Annealing
International Journal of Materials Science and Applications
Volume 4, Issue 5, September 2015, Pages: 288-292
Received: Aug. 3, 2015;
Accepted: Aug. 17, 2015;
Published: Aug. 24, 2015
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Igor Matyash, V. Lashkaryov Institute of Semiconductor Physics NAS of Ukraine, Kyiv, Ukraine
Irina Minailova, V. Lashkaryov Institute of Semiconductor Physics NAS of Ukraine, Kyiv, Ukraine
Boris Serdega, V. Lashkaryov Institute of Semiconductor Physics NAS of Ukraine, Kyiv, Ukraine
Volodymyr Maslov, V. Lashkaryov Institute of Semiconductor Physics NAS of Ukraine, Kyiv, Ukraine
Nataliya Kachur, V. Lashkaryov Institute of Semiconductor Physics NAS of Ukraine, Kyiv, Ukraine
Non-homogeneous cooling of glassceramics in the process of manufacturing brings about residual thermal stresses in bulk. Their evolution under annealing has been investigated by means of the method of modulation polarimetry. A 2D image enabled us to obtain tomograms of the distribution describing the value and sign of the uniaxial stress in the sample plane, which is parallel to the direction of a thermal flux. Relaxation of residual stresses has non-monotonic dependence versus the value of the annealing temperature. The nature of its origin has been discussed. Found in this work is coordinate dependence of a thermoelasticity coefficient, as well as its correlation with a stress function
Residual Stresses in Transparent Glassceramics and Their Evolution During Step-by-Step Annealing, International Journal of Materials Science and Applications.
Vol. 4, No. 5,
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