We report the direct-write fabrication of electric circuits on polyethylene terephthalate (PET) substrates by a low temperature technique. To demonstrate the utility of the concept, Radio Frequency Identification Circuit and Antenna Structures were fabricated on polyethylene terephthalate (PET), using a 300 dpi drop-on-demand HP DeskJet system. First, each substrate was prepared by low frequency atmospheric plasma etching, followed by tin (II) chloride treatment to enhance wetting. Then a catalytic silver seed layer pattern was bubble-jet printed onto the surface. Finally, the substrate was developed in a copper electroless plating bath for 10 min. to yield a 2.5 µm copper film with a sheet resistance of 3.4 Ωsq. The as-deposited film was shiny with a surface roughness of less than 8.7nm, which is about 0.35% of the film thickness. The films were characterized by SEM, EDX, profilometry, optical microscopy, and four-point probe resistivity measurement. This technology may be adapted for the direct-write fabrication of antenna structures for communication devices and space science applications.
| DOI | 10.11648/j.ijmsa.20140303.12 |
| Published in | International Journal of Materials Science and Applications (Volume 3, Issue 3, May 2014) |
| Page(s) | 84-87 |
| Creative Commons |
This is an Open Access article, distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution and reproduction in any medium or format, provided the original work is properly cited. |
| Copyright |
Copyright © The Author(s), 2024. Published by Science Publishing Group |
Direct-Write Fabrication, Silver Seed Layer, Characterization
| [1] | M. W. Jawitz, in Printed Circuit Board Materials Handbook, New York, McGraw-Hill, 1997. |
| [2] | K. Cheng, Y. Ming-Huan, W. W. Wanda, C.-Y. Chiu, J. C. Huang, Y. Tai-Fa and Y. Yang, "Ink-Jet Printing, Self-Assembled Polyelectrolytes, and Electroless Plating: Low Cost Fabrication of Circuits on a Flexible Substrate at Room Temperature," Macromol. Rapid Commun., p. 247–264, 2005. |
| [3] | K. F. Teng and R. Vest, "A microprocessor-controlled ink jet printing system for electronic circuits," IEEE Trans. Indust. Electron, pp. vol. 9, no. 11, pp. 591–592, 1988. |
| [4] | J. B. Szczech, C. M. Megaridis, D. R. Gamota and J. Zhang, Transactions on Electronics Packaging Manufacturing, IEEE, 2002, pp. 25, 26.. |
| [5] | N. Vigneshwaran, R. Nachane, R. Balasubramanya and P. Varadarajan, " A novel one-pot ‘green’ synthesis of stable silver nanoparticles using soluble starch," Carbohydrate Research, vol. 341, no. 12, pp. 2012-2018 , 2006. |
| [6] | S.-R. Veronica, M. Marie-Beatrice and S. G. Yeates, "Inkjet printing of 3D metal–insulator–metal crossovers," Reactive & Functional Polymers, p. 1052–1058, 2008. |
| [7] | Y. M. Lin and S. C.Yen, Appl. Surf. Sci., pp. 178, 116, 2001. |
| [8] | P. Smith, D. Shin, J. Stringer and B. Derby, Journal of Materials Science 41, p. 415, 2006. |
| [9] | E. O. Hall, Proc. Phys. Soc. London, pp. 64, 747, 1951. |
| [10] | N. J. Petch, J. Iron Steel Inst., pp. 174, 25, 1953. |
| [11] | C.-Y. K. Chouz and Kan-Sen, "Electroless Copper Plating onto Printed Lines of Nanosized Silver Seeds," Electrochemical and Solid-State Letters 10 (3), pp. 32 - 34, 2007. |
| [12] | K. Cheng, W. W. Chiu, C. Jang, C. Lai, Y. K. Ho and J. Chang, ''NIP 19: International Conference on Digital Printing Technologies'', p. 309–313., 2003. |
| [13] | J. Heinz and C. H. Hertz, "Ink-jet printing," Advances in Electronics and Electron Physics, vol. 65, p. 91–171, 1985. |
APA Style
Alu, Noble O., Oberafo, Anthony A., Iwok, et al. (2014). Low Temperature Direct-Write Fabrication of Radio Frequency Identification Circuit and Antenna Structures on Polymer Substrates. International Journal of Materials Science and Applications, 3(3), 84-87. https://doi.org/10.11648/j.ijmsa.20140303.12
ACS Style
Alu; Noble O.; Oberafo; Anthony A.; Iwok, et al. Low Temperature Direct-Write Fabrication of Radio Frequency Identification Circuit and Antenna Structures on Polymer Substrates. Int. J. Mater. Sci. Appl. 2014, 3(3), 84-87. doi: 10.11648/j.ijmsa.20140303.12
AMA Style
Alu, Noble O., Oberafo, Anthony A., Iwok, et al. Low Temperature Direct-Write Fabrication of Radio Frequency Identification Circuit and Antenna Structures on Polymer Substrates. Int J Mater Sci Appl. 2014;3(3):84-87. doi: 10.11648/j.ijmsa.20140303.12
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Download@article{10.11648/j.ijmsa.20140303.12,
author = {Alu and Noble O. and Oberafo and Anthony A. and Iwok and Unwana U. and Adama and Kenneth K. and Imalerio and Thomas I.},
title = {Low Temperature Direct-Write Fabrication of Radio Frequency Identification Circuit and Antenna Structures on Polymer Substrates},
journal = {International Journal of Materials Science and Applications},
volume = {3},
number = {3},
pages = {84-87},
doi = {10.11648/j.ijmsa.20140303.12},
url = {https://doi.org/10.11648/j.ijmsa.20140303.12},
eprint = {https://article.sciencepublishinggroup.com/pdf/10.11648.j.ijmsa.20140303.12},
abstract = {We report the direct-write fabrication of electric circuits on polyethylene terephthalate (PET) substrates by a low temperature technique. To demonstrate the utility of the concept, Radio Frequency Identification Circuit and Antenna Structures were fabricated on polyethylene terephthalate (PET), using a 300 dpi drop-on-demand HP DeskJet system. First, each substrate was prepared by low frequency atmospheric plasma etching, followed by tin (II) chloride treatment to enhance wetting. Then a catalytic silver seed layer pattern was bubble-jet printed onto the surface. Finally, the substrate was developed in a copper electroless plating bath for 10 min. to yield a 2.5 µm copper film with a sheet resistance of 3.4 Ωsq. The as-deposited film was shiny with a surface roughness of less than 8.7nm, which is about 0.35% of the film thickness. The films were characterized by SEM, EDX, profilometry, optical microscopy, and four-point probe resistivity measurement. This technology may be adapted for the direct-write fabrication of antenna structures for communication devices and space science applications.},
year = {2014}
}
TY - JOUR T1 - Low Temperature Direct-Write Fabrication of Radio Frequency Identification Circuit and Antenna Structures on Polymer Substrates AU - Alu AU - Noble O. AU - Oberafo AU - Anthony A. AU - Iwok AU - Unwana U. AU - Adama AU - Kenneth K. AU - Imalerio AU - Thomas I. Y1 - 2014/05/20 PY - 2014 N1 - https://doi.org/10.11648/j.ijmsa.20140303.12 DO - 10.11648/j.ijmsa.20140303.12 T2 - International Journal of Materials Science and Applications JF - International Journal of Materials Science and Applications JO - International Journal of Materials Science and Applications SP - 84 EP - 87 PB - Science Publishing Group SN - 2327-2643 UR - https://doi.org/10.11648/j.ijmsa.20140303.12 AB - We report the direct-write fabrication of electric circuits on polyethylene terephthalate (PET) substrates by a low temperature technique. To demonstrate the utility of the concept, Radio Frequency Identification Circuit and Antenna Structures were fabricated on polyethylene terephthalate (PET), using a 300 dpi drop-on-demand HP DeskJet system. First, each substrate was prepared by low frequency atmospheric plasma etching, followed by tin (II) chloride treatment to enhance wetting. Then a catalytic silver seed layer pattern was bubble-jet printed onto the surface. Finally, the substrate was developed in a copper electroless plating bath for 10 min. to yield a 2.5 µm copper film with a sheet resistance of 3.4 Ωsq. The as-deposited film was shiny with a surface roughness of less than 8.7nm, which is about 0.35% of the film thickness. The films were characterized by SEM, EDX, profilometry, optical microscopy, and four-point probe resistivity measurement. This technology may be adapted for the direct-write fabrication of antenna structures for communication devices and space science applications. VL - 3 IS - 3 ER -
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