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AFM Studies of the Effect of Chloride Ion on the Morphology of the Copper Electroplating Surface
Volume 3, Issue 2, April 2014, Pages: 15-18
Received: Jul. 1, 2014; Accepted: Jul. 15, 2014; Published: Jul. 20, 2014
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Masoud Delgosha, Department of Physics, University of Sistan and Baluchestan, 98135-674 Zahedan, Iran
Samira Salehi, Department of Physics, University of Sistan and Baluchestan, 98135-674 Zahedan, Iran
Leila Unesi borujeni, Department of physics, ShahidRajaee Teacher Training University, Lavizan, Tehran 16788-15811,Iran
Soheil Sharifi, Department of Physics, Faculty of Sciences, Ferdowsi University of Mashhad, Mashhad 91775-1436, Iran
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The influence of plating mode, chloride ion on morphology of copper deposits has been studied on pure copper substrate. The electroplating was conducted at 50mA/〖cm〗^2 , 25°C in cupric sulfate-sulfuric acid bath with various chloride additions 0.001-0.01 ml. The morphology and grain sizes of the electrodeposited copper were examined by atomic force microscopy. The maximum surface roughness and grain sizes of copper deposit were obtained when it was deposited with 0.01 ml of chloride ions. Small particles were observed on the surface of the copper film electroplated with the addition of chloride ions up to the amount of 0.001 ml.
Optic, DC Plating, Copper, Morphology, AFM
To cite this article
Masoud Delgosha, Samira Salehi, Leila Unesi borujeni, Soheil Sharifi, AFM Studies of the Effect of Chloride Ion on the Morphology of the Copper Electroplating Surface, Optics. Vol. 3, No. 2, 2014, pp. 15-18. doi: 10.11648/j.optics.20140302.12
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