Advances in Materials
Volume 8, Issue 4, December 2019, Pages: 176-182
Received: Nov. 12, 2019;
Accepted: Dec. 5, 2019;
Published: Dec. 13, 2019
Views 392 Downloads 210
Lu Fang, Department of Microsystems Integration, Sandia National Laboratories, Albuquerque, USA
Lyle Alexander Menk, Department of Microsystems Integration, Sandia National Laboratories, Albuquerque, USA
Hermetic microcircuit packaging was the dominant method of protecting semiconductor devices in the 1960s and 1970s. After losing majority market sectors to plastic encapsulated microelectronics over the last a few decades, hermetic packaging remains the preferred method of protecting semiconductor devices for critical applications such as in military, space, and medical fields, where components and systems are required to serve for several decades. MEMS devices impose additional challenges to packaging by requiring specific internal cavity pressures to function properly or deliver the needed quality (Q) factors. In MEMS multichip modules, internal pressure requirement conflicts arise when different MEMS devices require different internal gases and pressures. The authors developed a closed-formed equation to model pressure changes of hermetic enclosures due to gas ingression. This article expands the authors mathematical model to calculate gas pressure of a MEMS multichip module package as well as those of MEMS devices inside the multichip module package. These equations are not only capable of calculating service lifetimes of MEMS devices and multi-chip modules but can also help develop MEMS device packaging strategies to extend the service life of MEMS multi-chip modules.
Lyle Alexander Menk,
Gas Ingress and Egress of MEMS Multi-Chip Modules and MEMS Devices, Advances in Materials.
Vol. 8, No. 4,
2019, pp. 176-182.
T. K. Tang, R. C. Gutierrez, C. B. Stell, V. Vorperian, G. A. Arakaki, J. T. Rice, W. J. Li, I. Chakraborty, K. Shcheglov and J. Z. Wilcox, "A PACKAGED SILICON MEMS VIBRATORY GYROSCOPE FOR MICROSPACECRAFT," in Proceedings IEEE The Tenth Annual International Workshop on Micro Electro Mechanical Systems., Nagoya, Japan, 1997.
G. M. Rebiez and J. B. Muldavin, "RF MEMS Switches and Switch Circuits," IEEE Microwave Magazine, no. December, pp. 59-71, 2001.
S. Majumder, J. Lampen, R. Morrison and a. J. Maciel, "A Packaged, High-Lifetime Ohmic MEMS RF Switch," in IEEE MTT-S International Microwave Symposium Digest, Philadelphia, PA, 2003.
G. M. Rebeiz, G.-L. Tan and J. S. Hayden, "RF MEMS Phase Shifters," IEEE Microwave Magzine, no. June, pp. 78-81, 2002.
M. Lutz, A. Partridge, P. Gupta, N. Buchan, E. Klaassen, J. McDonald and K. Petersen, "MEMS OSCILLATORS FOR HIGH VOLUME COMMERCIAL APPLICATIONS," in TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference, Lyon, France, 2007.
D. XU, Y. WANG, B. XIONG and T. LI, "MEMS-based thermoelectric infrared sensors: A review," Frontiers of Mechanical Engineering, vol. 12, no. 4, pp. 557-566, 2017.
Y. Jin, Z. F. Wang, P. C. Lim, D. Y. Pan, J. Wei and C. Wong, "MEMS Vacuum Packaging Technology and Applications," in Proceedings of the 5th Electronics Packaging Technology Conferenc, Singapore, Singapore, 2003.
B. Lee, S. Seok and K. Chun, "A study on wafer level vacuum packaging," Journal of Micromechanics and Microengineering, no. 13, pp. 663-669, 2003.
C. W. Warren III and K. Najafi, "GOLD-INDIUM TRANSIENT LIQUID PHASE (TLP) WAFER BONDING FOR MEMS VACUUM PACKAGING," in IEEE 21st International Conference on Micro Electro Mechanical Systems, Wuhan, China, 2008.
R. Gooch, T. Schimert, W. McCardel, B. Ritchey, D. Gilmour and W. Koziarz, "Wafer-level vacuum packaging for MEMS," Journal of Vacuum Science & Technology A, vol. 17, no. 4, pp. 2295-2299, 1999.
S.-H. Choa, "Reliability of MEMS packaging: vacuum maintenance and packaging induced stress," Microsystem Technologies, no. 11, p. 1187–1196, 2005.
S.-H. Choa, "Reliability of vacuum packaged MEMS gyroscopes," Microelectronics Reliability, vol. 45, no. 2, pp. 361-369, 2005.
Z. Luo, D. Chen, J. Wang, Y. Li and J. Chen, "A High-Q Resonant Pressure Microsensor with Through-Glass Electrical Interconnections Based on Wafer-Level MEMS Vacuum Packaging," Sensors, vol. 14, no. 12, pp. 24244-24257, 2014.
R. Ramesham and R. C. Kullberg, "Review of vacuum packaging and maintenance of MEMS and the use of getters therein," J. of Micro/Nanolithography, MEMS, and MOEMS, vol. 8, no. 3, pp. 031307-1 - 031307-9, 2009.
D. Greywall, "Gas-damped micromechanical structure". USA Patent 5,786,927, 28 July 1998.
D. S. Greywall, P. A. Busch and J. A. Walker, "Phenomenological model for gas-damping of micromechanical structures," Sensors and Actuators, vol. 72, pp. 49-70, 1999.
L. Fang and A. L. Menk, "On Gas Ingression of Hermetic Packages," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 9, no. 6, pp. 1038-1044, 2019.
D. A. Howl and C. A. Mann, "The back-pressurising technique of leak-testing," Vacuum, vol. 15, pp. 347 - 352, 1965.
H. Greenhouse, R. Lowry and B. Romenesko, "Gas Kinetics," in Hermeticity of Electronic Packages, Waltham, MA, Elsevier, 2012, p. 2.