Study on the Causes of the Failure of the Insulation Resistance of Molded Inductors with Soft Magnetic Materials
Science Discovery
Volume 4, Issue 1, February 2016, Pages: 56-60
Received: Apr. 22, 2016; Published: May 4, 2016
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Authors
Guo Feng, Global Vision Trading Ltd, Kunshan City, Jiangsu Province, China
Li wei-jian, Global Vision Trading Ltd, Kunshan City, Jiangsu Province, China
Yan liang-ming, Material Science and Engineering College, Inner Mongolia University of Technology, Material Science and Engineering Institute, Hohhot, China
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Abstract
In this paper, the cause of the insulation resistance of molded inductor in low temperature baking is discussed, and the method to improve the insulation resistance is found. It was found that the surface bonding force between the metal soft magnetic powder and the coating layer increased first and then decreased with the increase of temperature, and the coating layer was brittle with the increase of temperature. The results show that the change of the volume change of the coating layer and the change of the surface binding force between the coating layer material in the curing process, and the higher the degree of curing the coating layer is brittle, and the interaction between the two and the coating layer can produce the peeling or even fall off.
Keywords
Soft Magnetic Powder, Insulation Resistance, Coated
To cite this article
Guo Feng, Li wei-jian, Yan liang-ming, Study on the Causes of the Failure of the Insulation Resistance of Molded Inductors with Soft Magnetic Materials, Science Discovery. Vol. 4, No. 1, 2016, pp. 56-60. doi: 10.11648/j.sd.20160401.20
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