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Diamond/Cu Composites Fabricated by Pressureless Infiltration Method

Received: 22 May 2016    Accepted:     Published: 23 May 2016
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Abstract

Copper matrix composites reinforced diamond (diamond/Cu) composites were successfully fabricated by pressureless infiltration method. The composition and structure of the coating are investigated using scanning electron microscopy(SEM), X-ray diffraction. The results indicate that the composition of the coatings is WC which is uniform on diamond. The microstructure and properties of diamond/Cu composites were investigated. The results show that the diamond/Cu composites were compact and WC transition layers onto diamond can greatly promote the compatibility between diamond and Cu. Further investigation reveals that the diamond/Cu composites possess low density (5.3907g/cm3), excellent thermal management function as a result of high thermal conductivity up to 761.1 W/(m•K) and a fine tightness (2.5×10-10 Pa•m3/s).

DOI 10.11648/j.sd.20160402.26
Published in Science Discovery (Volume 4, Issue 2, April 2016)
Page(s) 151-155
Creative Commons

This is an Open Access article, distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution and reproduction in any medium or format, provided the original work is properly cited.

Copyright

Copyright © The Author(s), 2024. Published by Science Publishing Group

Keywords

Pressureless Infiltration Method, Diamond/Cu Composites, Coating

References
[1] 高文珈,贾成光,楮克.金刚石/金属基复合新型热管理材料的研究与进展[J].材料导报,2011,25(2):17-26。
[2] 李 信,龙剑平,胥明.金刚石颗粒/金属基复合材料的研究进展[J].特种铸造及有色合金,2012,32(7):654−656。
[3] Zweben C., High-performance thermal management materials [J]. Advanced packaging, 2006, 15: 20。
[4] CHEN Chao, GUO Hong. Thermal conductivity of diamond/copper composites with a bimodal distribution of diamond particle sizes prepared by pressure infiltration method [J]. RARE METALS, 2011, 30(4): 408.
[5] XIA Yang. Influence of Interfaces on Thermal Conductivity of Diamond-Cu Composites for Heat Sink Application [J].JOURNAL OF SYNTHETIC CRYSTALS, 2009, 38(1): 171-174.
[6] Andrey M. Abyzov• Sergey V. Kidalov•Fedor M. Shakhov. High thermal conductivity composites consisting of diamond fillerwith tungsten coating and copper (silver) matrix [J]. Mater Sci, 2011, 46: 1424–1438.
[7] William B.Johnsonand B.Sonuparlak. Diamond/Al metal matrix composites formed by the pressureless metal infiltration process [J]. Mater.Res, 1993, 8(5): 1171-1173。
[8] MA Shuangya. Studyon Thermal Conductivity of Diamond/Copper Composite [J]. Material&Heat Treatment, 2008,37: 36-38.
[9] Congxu Zhu, Chan Wang, Nangang Maet. Si-coated diamond particles reinforced copper composites fabricated by spark plasma sintering process [J]. Materials and Manufacturing Processes. 2013, 28: 143-147.
[10] Chun Zhang• Richu Wang• Zhiyong Cai. Low-temperature densification of diamond/Cu compositeprepared from dual-layer coated diamond particles [J]. Mater Electron, 2015, 26: 185–190.
[11] Hua Bai, Nangang Ma, Jing Lang, Ying Jin, Congxu Zhu, Yi Ma. Thermo-physical properties of boron carbide reinforced copper composites fabricated by electroless deposition process [J]. Mater Des.2013, 46: 740–74.
Author Information
  • College of Aerospace Science and Engineering, National University of Defense Technology, Changsha, China

  • College of Aerospace Science and Engineering, National University of Defense Technology, Changsha, China

  • College of Aerospace Science and Engineering, National University of Defense Technology, Changsha, China

  • College of Aerospace Science and Engineering, National University of Defense Technology, Changsha, China

  • College of Aerospace Science and Engineering, National University of Defense Technology, Changsha, China

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  • APA Style

    Jia Jin-Hao, Xiong De-Gan, Bai Shu-Xin, Guo Wei-Qiang, Du Guang-Bao. (2016). Diamond/Cu Composites Fabricated by Pressureless Infiltration Method. Science Discovery, 4(2), 151-155. https://doi.org/10.11648/j.sd.20160402.26

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    ACS Style

    Jia Jin-Hao; Xiong De-Gan; Bai Shu-Xin; Guo Wei-Qiang; Du Guang-Bao. Diamond/Cu Composites Fabricated by Pressureless Infiltration Method. Sci. Discov. 2016, 4(2), 151-155. doi: 10.11648/j.sd.20160402.26

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    AMA Style

    Jia Jin-Hao, Xiong De-Gan, Bai Shu-Xin, Guo Wei-Qiang, Du Guang-Bao. Diamond/Cu Composites Fabricated by Pressureless Infiltration Method. Sci Discov. 2016;4(2):151-155. doi: 10.11648/j.sd.20160402.26

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  • @article{10.11648/j.sd.20160402.26,
      author = {Jia Jin-Hao and Xiong De-Gan and Bai Shu-Xin and Guo Wei-Qiang and Du Guang-Bao},
      title = {Diamond/Cu Composites Fabricated by Pressureless Infiltration Method},
      journal = {Science Discovery},
      volume = {4},
      number = {2},
      pages = {151-155},
      doi = {10.11648/j.sd.20160402.26},
      url = {https://doi.org/10.11648/j.sd.20160402.26},
      eprint = {https://download.sciencepg.com/pdf/10.11648.j.sd.20160402.26},
      abstract = {Copper matrix composites reinforced diamond (diamond/Cu) composites were successfully fabricated by pressureless infiltration method. The composition and structure of the coating are investigated using scanning electron microscopy(SEM), X-ray diffraction. The results indicate that the composition of the coatings is WC which is uniform on diamond. The microstructure and properties of diamond/Cu composites were investigated. The results show that the diamond/Cu composites were compact and WC transition layers onto diamond can greatly promote the compatibility between diamond and Cu. Further investigation reveals that the diamond/Cu composites possess low density (5.3907g/cm3), excellent thermal management function as a result of high thermal conductivity up to 761.1 W/(m•K) and a fine tightness (2.5×10-10 Pa•m3/s).},
     year = {2016}
    }
    

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  • TY  - JOUR
    T1  - Diamond/Cu Composites Fabricated by Pressureless Infiltration Method
    AU  - Jia Jin-Hao
    AU  - Xiong De-Gan
    AU  - Bai Shu-Xin
    AU  - Guo Wei-Qiang
    AU  - Du Guang-Bao
    Y1  - 2016/05/23
    PY  - 2016
    N1  - https://doi.org/10.11648/j.sd.20160402.26
    DO  - 10.11648/j.sd.20160402.26
    T2  - Science Discovery
    JF  - Science Discovery
    JO  - Science Discovery
    SP  - 151
    EP  - 155
    PB  - Science Publishing Group
    SN  - 2331-0650
    UR  - https://doi.org/10.11648/j.sd.20160402.26
    AB  - Copper matrix composites reinforced diamond (diamond/Cu) composites were successfully fabricated by pressureless infiltration method. The composition and structure of the coating are investigated using scanning electron microscopy(SEM), X-ray diffraction. The results indicate that the composition of the coatings is WC which is uniform on diamond. The microstructure and properties of diamond/Cu composites were investigated. The results show that the diamond/Cu composites were compact and WC transition layers onto diamond can greatly promote the compatibility between diamond and Cu. Further investigation reveals that the diamond/Cu composites possess low density (5.3907g/cm3), excellent thermal management function as a result of high thermal conductivity up to 761.1 W/(m•K) and a fine tightness (2.5×10-10 Pa•m3/s).
    VL  - 4
    IS  - 2
    ER  - 

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