A Model for Design Optimization of Electrochemical Mechanical Polishing Polish Pad
International Journal of Mechanical Engineering and Applications
Volume 5, Issue 4, August 2017, Pages: 223-227
Received: Jul. 11, 2017; Accepted: Jul. 19, 2017; Published: Aug. 11, 2017
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Authors
Bian Yanfei, The 54th Research Institute of China Electronics Technology Group Corporation, Shijiazhuang, China
Wang Zhenxuan, The 54th Research Institute of China Electronics Technology Group Corporation, Shijiazhuang, China
Cai Meng, The 54th Research Institute of China Electronics Technology Group Corporation, Shijiazhuang, China
Wang Ruofu, The 54th Research Institute of China Electronics Technology Group Corporation, Shijiazhuang, China
Tian Jingqun, The 54th Research Institute of China Electronics Technology Group Corporation, Shijiazhuang, China
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Abstract
The polishing pad plays a vital role in achieving the desired removal rate and level of surface planarity during the electrochemical mechanical planarization (ECMP) process. Material removal rate (MRR) and within wafer non-uniformity (WIWNU) are two important factors in determining the polishing performance. In this work, a theoretical model for predicting the radial distribution of tribasic ammonium citrate (TAC) concentration on the wafer is proposed. The experimentally measured MRR was found as a function of the TAC concentration in the slurry. Hence, the model could not only predict the removal rate at a given point on the wafer surface, but also reflect the WIWNU. Model predictions are in good agreement with the experimental data. The proposed model are used to perform an analysis of the effect of pad designs on the MRR and WIWNU of the wafer.
Keywords
Electrochemical Mechanical Polishing, Polish Pad, Removal Rate, Within Wafer Non-Uniformity, Model
To cite this article
Bian Yanfei, Wang Zhenxuan, Cai Meng, Wang Ruofu, Tian Jingqun, A Model for Design Optimization of Electrochemical Mechanical Polishing Polish Pad, International Journal of Mechanical Engineering and Applications. Vol. 5, No. 4, 2017, pp. 223-227. doi: 10.11648/j.ijmea.20170504.16
Copyright
Copyright © 2017 Authors retain the copyright of this article.
This article is an open access article distributed under the Creative Commons Attribution License (http://creativecommons.org/licenses/by/4.0/) which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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