Finite Element Analysis and Test of Braze Residual Stress Between Different Materials
Journal of Electrical and Electronic Engineering
Volume 7, Issue 3, June 2019, Pages: 75-81
Received: May 21, 2019;
Accepted: Jul. 2, 2019;
Published: Jul. 12, 2019
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Liu Shichao, Nanjing Electronic Devices Institute, Nanjing, China
Pang Xueman, Nanjing Electronic Devices Institute, Nanjing, China
Zhou Hao, Nanjing Electronic Devices Institute, Nanjing, China
Cheng Kai, Nanjing Electronic Devices Institute, Nanjing, China
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To assess the rationality and reliability of the finite element model, finite element analysis and test were performed on the braze residual stress between two materials with different expansion coefficients. The samples used in this paper were obtained by welding tungsten - copper wafers and kovar wafers. The finite element analysis method and stress testing method are introduced briefly. In order to describe the welding process, this paper uses several related equations to illustrate the simulation calculation, and introduces the complex analysis process of the test method, and briefly introduces the processing method of the test data. The test results mainly include the residual stress values corresponding to different depths on the drilling path, and the stress state at this position is expressed by tensile stress and compressive stress. The results of finite element simulation analysis are comprehensive. In order to compare with the test results, the direction and size of tensile stress and compressive stress of the section are selected. The results of test are consistent with those of finite element analysis. It was suggested that the residual stress obtained from the finite element model is feasible and can be referenced to understand the residual stress of the actual devices. Then an example is given to verify the consistency of the two methods.
Finite Element, Stress, Braze
To cite this article
Finite Element Analysis and Test of Braze Residual Stress Between Different Materials, Journal of Electrical and Electronic Engineering.
Vol. 7, No. 3,
2019, pp. 75-81.
Copyright © 2019 Authors retain the copyright of this article.
This article is an open access article distributed under the Creative Commons Attribution License (http://creativecommons.org/licenses/by/4.0/
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