Process Variables Optimization in Lapping of EN8 Material Using Taguchi Method
Engineering Mathematics
Volume 2, Issue 1, June 2018, Pages: 50-55
Received: May 30, 2018; Accepted: Jul. 25, 2018; Published: Sep. 12, 2018
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Authors
Rajesh Ramadass, Department of Production Engineering, PSG College of Technology, Coimbatore, India
Saravanan Sambasivam, Department of Production Engineering, PSG College of Technology, Coimbatore, India
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Abstract
The main aim of this work is to minimize the surface roughness in the flat lapping of EN8 material. The process variables considered for the study were lapping time, abrasive size and abrasive carrier oil proportion. The mathematical model related to the lapping such as surface finish model, stress model and its significance was understood. The (L9) orthogonal array in Taguchi method was utilized to conduct the experiments and surface roughness values were measured. The significance of each process variable on the surface roughness was studied using S/N ratio results. From the results, it was inferred that most influence factor among process variables is abrasive carrier oil proposition in slurry. Response table showed a delta value of 0.1967 for the abrasive carrier oil proposition in slurry. The optimum combination of process variables was determined based on S/N ratio and it was understood that minimum aluminum oxide abrasive proportion in slurry provides better surface quality in lapping of EN8 material. The optimum combination for minimum surface roughness were 15 minutes lapping time, 80 µm abrasive size and 1:3 abrasive carrier oil proportion in slurry.
Keywords
Lapping, Surface Roughness, Taguchi Method, S/N Ratio
To cite this article
Rajesh Ramadass, Saravanan Sambasivam, Process Variables Optimization in Lapping of EN8 Material Using Taguchi Method, Engineering Mathematics. Vol. 2, No. 1, 2018, pp. 50-55. doi: 10.11648/j.engmath.20180201.15
Copyright
Copyright © 2018 Authors retain the copyright of this article.
This article is an open access article distributed under the Creative Commons Attribution License (http://creativecommons.org/licenses/by/4.0/) which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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