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Mechanical Engineering and Applications on Semiconductor Industry
Submission DeadlineFeb. 20, 2020

Submission Guidelines: http://www.sciencepublishinggroup.com/home/submission

Lead Guest Editor
Jinfeng Wang
Engineering, Cabot Microelectronics, Aurora, USA
Guest Editors
  • Wei Fan
    Engineering, Cabot Microelectronics, Aurora, USA
  • Wei Wei
    Engineering, Cabot Microelectronics, Aurora, USA
  • Phil Fraundorf
    Physics, University of Missouri, St. Louis, USA
  • Wentao Qin
    R&D, On Semiconductor, Phoenix, USA
  • Qinmin Yang
    Mechanical Engineering Department, Zhejiang University, Hangzhou, Zhejiang, China
Introduction
The issue will focus on mechanical engineering and application on semiconductor and green energy. With the development of AI and clean energy, higher requirement of mechanical devices are needed to fit with smaller but smarter silicon chips. Hope the issue can help journal have more attention from both academic and industrial readers.
Aims and Scope:
  1. Mechanical design for silicon chips
  2. Mechanical design and challenges for next generation devices
  3. AI and clean energy trend and requirement for mechanical engineering
Guidelines for Submission
Manuscripts should be formatted according to the guidelines for authors
(see: http://www.sciencepublishinggroup.com/journal/guideforauthors?journalid=220).

Please download the template to format your manuscript.

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