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Mechanical Engineering and Applications on Semiconductor Industry
Submission Deadline: Feb. 20, 2020

This special issue currently is open for paper submission and guest editor application.

Join as Guest Editor Submit to Special Issue
Lead Guest Editor
Jinfeng Wang
Engineering, Cabot Microelectronics, Aurora, USA
Guest Editors
  • Wei Fan
    Engineering, Cabot Microelectronics
    Aurora, USA
  • Wei Wei
    Engineering, Cabot Microelectronics
    Aurora, USA
  • Phil Fraundorf
    Physics, University of Missouri
    St. Louis, USA
  • Wentao Qin
    R&D, On Semiconductor
    Phoenix, USA
  • Qinmin Yang
    Mechanical Engineering Department, Zhejiang University
    Hangzhou, Zhejiang, China
Guidelines for Submission
Manuscripts can be submitted until the expiry of the deadline. Submissions must be previously unpublished and may not be under consideration elsewhere.
Papers should be formatted according to the guidelines for authors (see: http://www.sciencepublishinggroup.com/journal/guideforauthors?journalid=220). By submitting your manuscripts to the special issue, you are acknowledging that you accept the rules established for publication of manuscripts, including agreement to pay the Article Processing Charges for the manuscripts. Manuscripts should be submitted electronically through the online manuscript submission system at http://www.sciencepublishinggroup.com/login. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal and will be listed together on the special issue website.
Published Papers
The special issue currently is open for paper submission. Potential authors are humbly requested to submit an electronic copy of their complete manuscript by clicking here.

Special Issue Flyer (PDF)

Please download to know all details of the
Special Issue

The issue will focus on mechanical engineering and application on semiconductor and green energy. With the development of AI and clean energy, higher requirement of mechanical devices are needed to fit with smaller but smarter silicon chips. Hope the issue can help journal have more attention from both academic and industrial readers.
Aims and Scope:
  1. Mechanical design for silicon chips
  2. Mechanical design and challenges for next generation devices
  3. AI and clean energy trend and requirement for mechanical engineering
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