Abstract: Wire bonding attaches a fine wire from one connection pad to another, completing an electrical connection. Reduction-assisted immersion gold (RAIG) has recently gained popularity due to its ability to eliminate corrosion and plate thicker gold deposits. Implementing a RAIG process improves quality and reduces wire bonding product reliability risk. The purpose of this research was two-fold: 1) evaluate the effects of crossing two RAIG thicknesses against three wire bonding gram-forces on wire bond pull strength, and 2) evaluate two independent RAIG thickness effects on wire bond pull strength, all on an electroless nickel electroless palladium immersion gold (ENEPIG) final finished printed circuit board. A quantitative, experimental research methodology was used to manipulate independent variables to observe the effect on the dependent variable, establishing cause-and-effect relationships for wire bonding. This method was selected because of its ability to identify and quantify statistically significant factors for gold plating and wire bonding. Data was generated and collected in a controlled laboratory setting. Multi-variate charts, analysis of variance (ANOVA), lognormal distributions, and descriptive statistics were used for data analysis. As the RAIG deposit thickness increases, the bond gram-force is not vital for wire pull strength. Thicker RAIG deposits statistically outperform thinner RAIG deposits for wire pull strength. A mixed reaction RAIG electrolyte enables robust designs and achieves world-class quality "on target with minimal variation."
Abstract: Wire bonding attaches a fine wire from one connection pad to another, completing an electrical connection. Reduction-assisted immersion gold (RAIG) has recently gained popularity due to its ability to eliminate corrosion and plate thicker gold deposits. Implementing a RAIG process improves quality and reduces wire bonding product reliability risk. ...Show More
